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1 - 4 of 4 resultsSearch results for "design package"
Materials for High-Density Electronic Packaging and Interconnection (1990)
National Research Council; Division on Engineering and Physical Sciences; Commission on Engineering and Technical Systems; National Materials Advisory Board; Committee on Materials for High-Density Electronic Packaging
Engineering and Technology
Microelectromechanical Systems: Advanced Materials and Fabrication Methods (1997)
National Research Council; Division on Engineering and Physical Sciences; Commission on Engineering and Technical Systems; National Materials Advisory Board; Committee on Advanced Materials and Fabrication Methods for Microelectromechanical Systems
Engineering and Technology
Materials Science and Engineering: Forging Stronger Links to Users (1999)
National Research Council; Division on Engineering and Physical Sciences; Commission on Engineering and Technical Systems; National Materials Advisory Board; Committee on Materials Science and Engineering: Forging Stronger Links to Users
Engineering and Technology | Industry and Labor
Materials for High-Temperature Semiconductor Devices (1995)
National Research Council; Division on Engineering and Physical Sciences; Commission on Engineering and Technical Systems; National Materials Advisory Board; Committee on Materials for High-Temperature Semiconductor Devices
Engineering and Technology